High strength thermal silicone pad
Product features
application:
● Electronic Components：IC，CPU，MOS；
● Battery, M/B, P/S, Heat Sink, LCD-TV,Notebook PC, PC, Telecom Device,Wireless Hubetc；
● DDR ⅡModule/DVD Application/Hand-set Application etc.
Features and advantages:
● 0.8~1.0 W/m.k Thermal Conductivity；Self tacky；
● Low thermal impedence；V-0 Recnogizned；
● Ultra Soft and High Compressibility；
● With expansive fire-fighting capabilities；
EIGENVALUE
